Automated application of cut thermal adhesive films

ABSTRACT

Method of manufacturing a substrate with a cut thermal film comprises obtaining an input digital image of a design to be transferred to the substrate; storing the input image in memory; rendering design elements of the design as a single output image; based upon a bleed size value, a maximum number of negative areas, a maximum number of positive areas, and attribute values: resizing the image to include a border for bleed; filling transparent areas of the image with the substrate attribute values; creating a cutting path; creating a mask image; inverting the mask image; modifying the mask image to adjust fill areas around details, to limit negative areas to be less than the maximum number of negative areas, and to limit positive areas to be less than the maximum number of positive areas; creating cutting path data in memory as a vector path outlining the mask image.

BENEFIT CLAIM

This application claims the benefit of provisional application62/133,946, filed Mar. 16, 2015, the entire contents of which is herebyincorporated by reference as if fully set forth herein, under 35 U.S.C.§119(e).

FIELD OF THE DISCLOSURE

The disclosure generally relates to methods of manufacturing productsthat are decorated with films, such as wearing apparel. The disclosurerelates more specifically to computer-driven techniques forautomatically applying cut thermal adhesive films to other products.

BACKGROUND

The approaches described in this section are approaches that could bepursued, but not necessarily approaches that have been previouslyconceived or pursued. Therefore, unless otherwise indicated, it shouldnot be assumed that any of the approaches described in this sectionqualify as prior art merely by virtue of their inclusion in thissection.

Plastic films with thermal adhesive backing are used for decorating awide variety of materials and products. While these films are sometimesreferred to as heat transfer vinyl, modern heat transfer films areusually manufactured from urethane, polyester, or polypropylene to avoidthe toxicity of vinyl chloride when exposed to heat.

Cut thermal adhesive films are composed of at least two layers, theplastic substrate, and a thermal adhesive coating. The substrate oftencontains a colorant or additional decorative additives. The films areusually affixed to a backing paper or plastic substrate. Films of thistype may be cut with a plotter/cutter machine so that regions of thefilm cut film may describe lettering or a decorative shape or image.Often the films are cut in a manner that leaves the backing film orpaper intact. The type of cutting is called a ‘kiss cut’.

After cutting, the portions of the film that do not include thelettering or shape to be transferred must be removed. Thenon-transferred portion of the film is called the ‘negative area’.Removing the negative areas of the film for all but the simplest designsis performed by heat press operators as a manual process. The manualremoval of negative areas of heat transfer films is called ‘weeding’.After weeding, the positive areas of the film are transferred using aheat press to the surface of the material or product to be decorated.

The labor costs for weeding constrains the complexity of designs thatmay be used for decorating objects with heat transfer films. While thereare other processes such as pad printing, screen printing, and directinkjet printing that may easily handle complex designs, heat transferfilms may be formulated to adhere to and decorate a much wider varietyof materials and combination of materials found in products than otherdecorative printing processes. Heat transfer films may also bemanufactured with metal films or flakes, or be embossed to form otheroptically active surfaces.

Given the versatility of heat transfer films, it is useful to devise asystem and method for the automated removal, or weeding, of the negativedesign areas prior to heat transfer that is integrated into theapplication of the cut thermal transfer film.

SUMMARY

The appended claims may serve as a summary of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1A is an example data flowchart depicting an infrastructure forautomatically cutting a design on thermal transfer film using one ormore computing devices.

FIG. 1B illustrates an example logic architecture of the serviceprovider computer.

FIG. 2 is an example data flowchart for a method of automaticallycutting a design on thermal transfer film.

FIG. 3A depicts a thermal transfer film with a cut out design.

FIG. 3B depicts a receiver sheet being attached to the transfer film ofFIG. 3A.

FIG. 3C depicts the receiver sheet being used to remove the negativeareas of the design on the transfer film of FIG. 3A.

FIG. 4 is a block diagram that illustrates a computer system upon whichembodiments may be implemented.

FIG. 5 illustrates an example design in which all elements have beenrendered as a single output with alpha channel.

FIG. 6 illustrates the design of FIG. 5 in which digital inversion hasbeen applied.

FIG. 7 illustrates a rendering of the design of FIG. 6 in which afirst-level growth step has been applied.

FIG. 8 illustrates a rendering of the design of FIG. 7 in which asetting step has been performed.

FIG. 9 illustrates an example of the result of growing the image.

FIG. 10 illustrates an example in which a BorderList has been renderedto a MaskImage, as defined in the description.

FIG. 11 illustrates an example of the result of an inversion step.

FIG. 12 illustrates an example of both a final CutPath and OutputImage.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of the present invention. It will be apparent, however,that the present invention may be practiced without these specificdetails. In other instances, well-known structures and devices are shownin block diagram form in order to avoid unnecessarily obscuring thepresent invention.

1. General Overview

In an embodiment, a method of manufacturing a tangible substrate with athermal film that is cut according to computer instructions comprisesobtaining an input digital image of a design that is to be transferredto the tangible substrate and storing the input digital image inelectronic digital memory of a computer; using the computer, rendering aplurality of design elements of the design as a single output image;using the computer and based upon the output image, a bleed size value,a maximum number of negative areas, a maximum number of positive areas,and one or more substrate attribute values: resizing the output image toinclude a border for bleed; filling all transparent areas of the outputimage with the one or more substrate attribute values; creating andstoring a cutting path; creating and storing a mask image; digitallyinverting the mask image in the memory; modifying the mask image toadjust one or more fill areas around one or more details, to limitnegative areas to be less than the maximum number of negative areas, andto limit positive areas to be less than the maximum number of positiveareas, resulting in a modified mask image; creating and storing cuttingpath data in the memory, comprising a vector path on an outline of themask image; transmitting the cutting path data over a computer network.

In one feature, the output image includes alpha channel data, andwherein creating and storing a mask image comprises copying the alphachannel data to a one-channel image having a same size as the outputimage.

In another feature, the method comprises preprocessing the plurality ofdesign elements of the input digital image by one or more of: creatingalpha channel data for the input digital image when the input digitalimage lacks alpha channel data; for each of one or more text elements inthe input digital image, creating a background balloon having a color,texture or pattern that corresponds to the substrate.

In yet another feature, the method further comprises copying the maskimage in memory to create a one-channel fill image of a same size as themask image; based on a fill size value and a pixels-per-inch value,shrinking a fill image size of the fill image by a product of the fillsize value and pixels-per-inch value, and growing the fill image size ofthe fill image by a product of the fill size value and pixels-per-inchvalue; setting each pixel in the mask image to a lesser value of a maskimage pixel value and a fill image pixel value, resulting in modifiedmask image data for an opaque region that covers all the designincluding fine details.

In a further feature, the one or more substrate attribute valuescomprise any one or more of color, texture and pattern of the substrate.

In still another feature, the method further comprises using the cuttingpath data, driving a cutting machine to cut a thermal transfer film;removing selected image area from the thermal transfer film; heattransferring the thermal transfer film to the substrate.

In yet another feature, the method further comprises using the cuttingpath data, driving a cutting machine to cut a film on a backing sheet todescribe a decorative design and to provide a registration means;attaching a film portion corresponding to unused portions of the designto a receiving sheet using the registration means and an attachmentmeans; removing the film portion corresponding to the unused portions ofthe design from the backing sheet using the receiving sheet; attaching asecond film portion corresponding to remaining portions of the design onthe backing sheet to the substrate.

In various other features, the cutting means and the attachment meansare automated by a positioning means and a motion control means; themotion control means and the positioning means are controlled by aseries of instructions; a second series of instructions for motioncontrol of the attachment means is derived from the cutting path data.

In still another feature, the method further comprises using the cuttingpath data, driving a cutting means to cut a thermal adhesive film on abacking sheet to describe a decorative design and to provide aregistration means; attaching unused portions of the film to a receivingsheet using a registration means and a thermal attachment means;removing the unused portions of the film from the backing sheet usingthe receiving sheet; attaching remaining portions of the film to thesubstrate.

In various approaches, the cutting means and the attachment means areautomated by a positioning means and a motion control means; the motioncontrol means and the positioning means are controlled by a series ofinstructions; a second series of instructions for motion control of theattachment means is derived from the cutting path data.

In some embodiments, the substrate comprises an article of wearingapparel. Examples include hats, shirts, jackets, sweatshirts and pants.In other embodiments, the substrate may comprise other natural orsynthetic textile or non-textile items such as bags, totes, cases, etc.

2. Foundation Technology

2.1 ACTAF Disclosure. Prior U.S. patent application Ser. No. 14/671,598,filed Mar. 27, 2015, which claims priority to provisional application61/972,178, filed Mar. 28, 2014, describes a system and method forautomated application of cut thermal adhesive films internally denotedACTAF, and to the maximum extent permitted under national law, theentire contents are hereby incorporated by reference as if fully setforth herein. The ACTAF disclosure also is set forth in the APPENDIX.

2.2 Laser Weeding. The automated removal of negative design areas may beperformed by laser ablation. Laser ablation is a process by which aportion of a material is removed by rapidly heating with light from alaser so that portion of the material in converted directly from a solidto gas. Using laser cutting and ablation to cut and remove material fromheat transfer films is a well-known process, and the manufacture and useof specialty films for laser cut transfer are protected by patent. Theheat transfer film is manufactured so that its transfer characteristicsare preserved, and is designed to minimize the toxicity of the gasresulting from laser ablation. Films with large variation in surfacethickness may be difficult to process. The reflective properties of thefilm must be designed so that laser ablation may take place. ManyMetallic and Holographic films are difficult or impossible to weed inthis manner. Laser ablation requires that the full negative area betraversed, rather than just the cut edge. This can greatly increase thecutting time for processing thermal transfer films. Laser weeding ofthermal transfer films is well suited to transferring small complexdesigns using a constrained set of colors and surfaces.

2.3 Selective Thermal Transfer. The pigmented film may be designed sothat it separates well when part of it is transferred to a substrate byselective heat application. Many printing processes transfer pigmentedwaxes or thermoplastics from a carrier sheet or ribbon onto a substrate.Specialty thermal transfer sheets may be manufactured with transferabledots, segments or regions. These processes impose limits on the varietyof optical effects and durability of the material that is transferred.These processes may also result in a broken or approximate edge for thetransferred design. While heat presses may be built to conform to avariety of surface shapes and curvatures, building a machine forselective application of heat transfer for a custom shape or surface maybe prohibitively expensive.

2.4 Masked Thermal Transfer. Some transfer processes use a mask to blocktransfer of negative design areas. These processes have many of the samefeatures of selective thermal transfer processes, and also require theproduction or printing of a mask.

While each of these methods provides automated removal or masking of thetransfer of negative design areas, each is limited it the type ofmaterial that may be transferred. Embodiments of the processes disclosedherein may be used with a broad range of thermal transfer films, may useexisting film types and cutting equipment, and may be inserted intoexisting manufacturing flows.

3. Process Overview

This disclosure assumes familiarity with U.S. Pat. No. 8,174,521; U.S.Pat. No. 8,175,931; and application Ser. No. 12/790,711, filed May 28,2010, the entire contents of which are hereby incorporated by referencefor all purposes as if fully set forth herein. These disclosuresgenerally relate to computer-implemented systems that are programmed orconfigured to operate in connection with a service provider who receivesorders for customized products and then either directly fulfills theorders or brokers or provides them to external makers or custommanufacturers. Some of the customized products may involve printing agraphical design or image on a tangible product; examples includeapparel, bags, hats and the like. The images original from electronicdigital graphical images that are originally authored usingcomputer-based image design programs, CAD systems, or other artproduction systems. Printing on the products may use thermal transfertechniques as described herein.

3.1 ACTAF Technique

A system and method disclosed herein for automated Application of CutThermal Adhesive Films will be called ACTAF for brevity. Cut ThermalTransfer Films will be called CTTF for brevity. Other processes formanufacturing, cutting and transferring CTTFs are well developed. Sincethese technologies work well, and are relatively inexpensive, it isbeneficial to use these existing materials and processes in some aspectsof the present disclosure. ACTAF is designed to be inserted in theweeding step in the manufacturing flow for decorating products byapplying CTTFs. ACTAF is designed to use existing off-the-shelfcomponents when possible.

In an embodiment, specific steps to decorate a product using CTTFs andACTAF comprise:

1. Read file or instructions that describe regions to be cut using anexisting plotter/cutter device.

2. Generate additional instructions for ACTAF.

3. Add additional registration means for ACTAF to the instructions forthe plotter/cutter.

4. Cut the CTTF using the instructions from step 3, and theplotter/cutter device.

5. Register the CTTF on the ACTAF device using the registration means.

6. Register a receiver sheet on the ACTAF device, note that the receiversheet may already be part of the CTTF.

7. Use the ACTAF device and the instructions generated in step 2 toselectively attach the negative design areas of CTTF to a receiversheet.

8. Remove the receiver sheet and the attached negative design areas fromthe CTTF in one step, thereby concurrently achieving weeding.

9. Place the CTTF on the product or substrate to be decorated.

10. Transfer the positive design areas of the CTTF to the product orsubstrate using a heat press device.

Before reviewing the steps in detail, it is useful to describe anembodiment of a device which may be used for ACTAF.

3.1.1 The ACTAF Device. The ACTAF device needs to be able to applyselective heat and pressure to specific points and paths to attach thenegative design area portions of the CTTF to the receiver sheet. Asnoted in the steps, depending on the type of CTTF, the thermal adhesiveportion of the film may be positioned facing the backing sheet for theCTTF or facing away. If the adhesive portion of the CTTF faces away fromthe backing sheet, a separate receiver sheet will be used. The ACTAFdevice may be composed of the following means:

3.1.1.1 Registration Means. The ATCIF device needs a surface to hold thecut CTTF and receiver sheet firmly in a known position that isregistered to the cutting performed by the plotter cutter. In oneembodiment this is a flat aluminum platen with registration pins thatmatch a hole cut through the CTTF by the plotter/cutter as directed bystep 2 above. Additionally the registration means may have a cut channelthat is bigger than the maximum size of the CTTF to be processed, butsmaller than the receiver sheet, or a flexible sheet framing the cutarea. Additionally the cut channel may be used to draw the CTTF onto theplaten by applying a vacuum to the cut channel. In another embodiment,the Registration means is a set of rollers that hold the CTTF against aplaten, and which determines the position of the CTTF by opticallydetecting holes in the CTTF cut through the CTTF by the plotter/cutteras directed by step 2.

3.1.1.2 Thermal Point Source Means. The ACTAF device needs a means toattach the thermal adhesive on the negative design areas for the CTTF tothe receiver sheet. In many embodiments this is a thermal point source.The thermal point source may be a heat conductive material, such ascopper, shaped to have a smooth point. Heat may be applied to the copperpoint using heat generated by electrical resistance. Additionally theremay be a heat sensor which measures the heat of the Thermal Point SourceMeans. Additionally there may be a means to set and maintain thetemperature of the Thermal Point Source Means at a given temperature.Additionally that temperature may be set to the temperature needed toattach the CTTF thermal adhesive to the receiver sheet within a setdistance from the center of the Thermal Point Source Means.

3.1.1.3 Positioning Means. The ACTAF device needs a means to positionThermal Point Source Means at a specific location on the CTTF as it isheld on the Registration Means. It will also need a means to apply aknown force or pressure to the CTTF at a specific point. In oneembodiment the positioning means is an X,Y,Z gantry with servo motors,such as those used for positioning routers or drills. In anotherembodiment, the Positioning means is a set of rollers to move the CTTFrelative to the Thermal Point Source Means in the Y direction, aCarriage to move the Thermal Point Source Means relative to the CTTF inthe X direction, and a servo mechanism to move the Thermal Point SourceMeans relative to the CTTF in the Z direction and to apply pressure.Additionally, in some embodiments, the pressure or force that theThermal Point Source Means applies to the CTTF may be adjusted limitedor modified by being held in place by a spring and a means to adjust thespring.

3.1.1.4 Motion Control Means. The ACTAF device needs a Motion ControlMeans to convert the instructions for where to attach the negativedesign areas of the CTTF to the receiver sheet to control inputs to thePositioning means. In some embodiments it controls the inputs to theThermal Point Source Means to change the size of region that may beattached to the receiver sheet, or to control heat needed for rapidmotion of the Thermal Point Source traversing the CTTF. This MotionControl Means may be a microcontroller contained in a device such as theX, Y, Z gantry robot described as the positioning means. Theinstructions the microcontroller accepts may be a standard NumericalControl language such as G-Code.

3.1.2 ACTAF—Detailed Description of Specific Steps

Generating Instructions for ACTAF. In some embodiments, the instructionsfor ACTAF consist of G-Code statements. G-Code is a language fornumerical control of (among many others) NC drilling machines androuters. It consists of statements directing the motion of the machinein 3 dimensions. Through these commands, the machine may trace a pathwith a known tolerance. In some embodiments, software is used togenerate the cut path for the plotter/cutter, and the paths for theACTAF device. The path generated for the ACTAF, while it may use thesame vector input as the cut path, must be modified for ACTAFs task.

Thermal Attachment Resolution. The ACTAF device applies heat to aspecific area on the CTTF. There must be enough heat to firmly attachthe film to the receiver sheet, but not so much heat that an adjacentpositive region is also attached. This constraint imposes a distance orattachment resolution based on the qualities of the CTTF. In someembodiments, with some CTTF types, this resolution is about 0.5millimeters.

Minimum attachment Point. The minimum width of a negative design regionto be attached is 2× the Thermal Resolution. In the embodiment and theCTTF cited above, this would be 1.0 millimeter. In the case of a 1.0millimeter dot, a single point application of the Thermal Point Sourcewould attach this region.

Minimum Tear Span. Some CTTFs regions will pull away with onlyattachment at the edge. Others will tear based on the pull of the CTTF'sattachment to its backing film. The maximum distance between attachmentpoints that will not tear is called the minimum tear span. It is usefulto know this for a CTTF, since it minimizes the time it takes for theACTAF to attach the negative design areas.

Path Inset. To generate a tacking path for a single negative designregion, the instruction generating software will need to inset thedesign path by the Thermal Resolution distance. Within this inset, thesoftware will need to add paths to avoid tearing using the Minimum TearSpan.

3.1.3 Processing Instructions for ACTAF

In some embodiments, the ACTAF device processes a standard language,such as G-Code, for numerical control that drives the positioning andapplication of pressure. In other embodiments the ACTAF device mayreceive the same files that are processed by the plotter/cutter or aRIP, such as a PDF file, and a processor in the device generates theinstructions for Motion control as described above in ‘GeneratingInstructions for ACTAF’ within the device itself. In some embodimentsadditional controllers may adjust temperature and pressure of theThermal Point Source in response to temperature and force sensingattached to the Positioning Means and the Thermal Point Source.

3.1.4 Weeding and Transfer

In many embodiments, a CTTF is used which has the thermal adhesivefacing away from the backing sheet. For these embodiments, a receiversheet is cut or punched to match the registration means of the ACTAF.The negative design areas are attached to the receiver sheet by theACTAF, and then the receiver sheet is removed from the CTTF, along withthe attached negative design areas. The CTTF with Backing paper and thepositive design areas is positioned on a substrate or product. Theresulting sandwich is heat pressed, and the backing sheet is removed.

In some embodiments, a CTTF is used which accepts inkjet printing. Insome of these films the backing sheet for the CTTF will not acceptthermal attachment to the negative areas of the design; these films areprocessed by the ACTAF to attach the printed side of the negative areasto a registered receiver sheet coated with a thermal adhesive. Thenegative design areas are attached to the receiver sheet by the ACTAF,and then the receiver sheet is removed from the CTTF, along with theattached negative design areas. The printed side of the CTTF withbacking paper and the printed positive design areas is then covered witha transfer sheet which is coated with repositionable adhesive. Thetransfer sheet is pressed so that it adheres firmly to the CTTF. Thetransfer sheet is then separated from the backing sheet. The transfersheet is used to position the positive design of the CTTF film on asubstrate or product. The resulting sandwich is heat pressed, and thetransfer sheet is removed.

3.2 Flex-Flock Processing Techniques

The inventors, in an inventive moment, discovered that the followingprocess may be effectively used to generate data that can drive cuttingequipment for use in flex and flock transfer printing. Flex and flocktransfer printing is often used for prints containing 1 to 3 colors andfor small production runs, such as up to 50-100 units. Flex and flocktransfer printing is suitable for text prints, simple logos, symbols andprint elements drawn in vector graphics. The print is created by cuttingout elements from a special material and melting them with the garmentsusing a heat press. The process can be used to produce prints with asmooth surface, reflective surface, velvet service, glow-in-the-darkeffects, glittering prints, etc. The technology can be used to print ongarments, and also to print on large-scale fabric surfaces such as clothcurtains, roller blinds, flags and others. Most commonly it is used forprinting on promotional products such as jackets, umbrellas, bags,sportswear etc.

In one embodiment, the processing steps shown in TABLE 1 are used. In anembodiment, the algorithm described in this section may be used as abasis for programming a computer to receive, transform, and storeelectronic digital data representing both a cutting path forcomputer-driven cutting machinery, and a printed design forcomputer-driven printing equipment.

TABLE 1 EXAMPLE PROCESSING STEPS 1. Preprocess design elements. Imagesare converted to a high contrast monochrome mask. Text is rendered as ahigh contrast monochrome mask. The design elements then are rendered asa single MaskImage. 2. Process MaskImage for display or print. Inputparameters include: MaskImage, a high contrast monochrome mask.NegativeSize, the minimum dimension, in inches, that may be cut as anegative area PositiveSize, the minimum dimension, in inches, that maybe cut as a positive area SamplePPI, the pixels per inch of the outputimage. MaximumNegativeRegions, the maximum number of negative areasallowed MaximumPositiveRegions, the maximum number of positive areasallowed 2.1 Build the Cut path 2.1.1 Filter for Size 2.1.1.1 ShrinkMaskImage by (PositiveSize*0.25 * iSamplePPI)pixels. 2.1.1.2 GrowMaskImage by ((PositiveSize*0.5 + NegativeSize*0.5) * iSamplePPI)2.1.1.3 Shrink MaskImage by (NegativeSize*0.5 * iSamplePPI)pixels. 2.1.2Filter to limit negative areas (reduce number of areas to weed) 2.1.2.1Invert the MaskImage (pixel = 1.0-pixel) 2.1.2.2 Add each positiveregion in the image to a list called the RegionList 2.1.2.3 Sort theRegionList by region area, largest to smallest. 2.1.2.4 Limit the countof the RegionList to MaximumNegativeRegions. 2.1.2.5 Render theRegionList to the MaskImage. 2.1.2.6 Invert the MaskImage (pixel =1.0-pixel) 2.1.3 Filter to limit positive areas 2.1.3.1 Add eachpositive region in the image to a list called the RegionList 2.1.3.2Sort the RegionList by region area, largest to smallest. 2.1.3.3 Limitthe count of the RegionList to MaximumPositiveRegions. 2.1.3.4 Renderthe RegionList to the MaskImage. 2.1.4 Convert the MaskImage outline toa vector path called the CutPath 2.1.5 Dispose of MaskImage Return theCutPath

3.3 CAD-Cut Processing Techniques

In CAD-Cut thermal transfer, a thermal transfer film is first printed,typically based upon a design or image that is initially created using acomputer-aided design (CAD) system. After printing, the printed thermaltransfer film is tacked to a backing sheet and then cut. A transfersheet is attached. Selected image area is removed and the transfer sheetthen is used to heat transfer the film to the substrate.

4. Detailed Description of Example Algorithm

In an embodiment, the algorithm shown in TABLE 1 and further describedin this section may be used as a basis for programming a computer toreceive, transform, and store electronic digital data representing acutting path for computer-driven cutting machinery for use with CAD-Cutthermal transfer film, based upon a CAD design intended for use withcomputer-driven printing equipment to print on the film. In other words,the design has been previously created and is received in digitalelectronic form as a vector image, or a combination of a vector imageand text, and the algorithm herein is used to define the cut region orcutting path. In an embodiment, the algorithm described in this sectionmay be used as a basis for programming a computer to receive, transform,and store electronic digital data representing preview images for onlinedisplay to designers as further described.

The algorithm is useful with any image-text combination that can beseparated into a positive region for transfer to a substrate and anegative region that is not transferred. In general, in an embodiment,the algorithm is configured to filter the input image to identify andfill in around areas that otherwise would be too small to cut around andtransfer. Further, the algorithm is configured to limit the total numberof positive areas and negative areas so that total processing time usingthe cutting equipment will be reasonable for commercial production withreasonable throughput of customer orders. In other words, while a designcould be arbitrarily complex, there is a commercial desire to limit theamount of time involved in cutting the design and weeding the negativeareas prior to transfer.

The following discussion follows the outline of steps shown in TABLE 1.

1. Preprocess the design elements. For received images, create an alphachannel. If an alpha channel is already present it may be used, or itmay be synthesized by various means if it is missing with the goal offinding the main perimeter edge of the image. For example, in onesynthesis approach, every pixel that is connected to a background coloris identified and used as the alpha channel, or all white large areasare identified. The background may be identified by seeking large groupsof contiguous similarly colored pixels while leaving the internal shapesunaffected. For text, create a background ‘balloon’ with the color,texture, and/or pattern of the substrate. Various statistical techniquesmay be used to detect text within an image.

As detailed in subsequent steps, to make the image easier to weed,ultimately all areas that are transparent or in the alpha channel arecolored with the substrate color. The result is a reasonable borderaround the image as well as coloration of internal areas with thesubstrate color so that they blend in with the substrate and appeartransparent or in the background as intended by the designer. Thesubstrate is the product or material to be decorated.

Statistical analysis of image data may be used in these steps to improveresults. For example, use of the white pixel detection process notedabove may be used only for regions that appear to represent image edgesso that elements such as white portions of character eyes are notdesignated as transparent and changed to the substrate color. Countingthe number of positive image areas and negative image areas, for a knowntwo-color image, may be used to determine that a particular regionlikely includes text so that attempting to transform it to the substratecolor should be done. Alternatively statistical analysis may indicatethat the number of white areas is so large that they probably do notrepresent transparent areas so that transformation to the substratecolor should not be done; examples would be design elements containinggroups of white dots, rows of stars and the like. White areas thatshould be transparent typically would be expected to be smaller innumber.

2. Render the design elements as a single OutputImage with alphachannel. FIG. 5 illustrates an example design in which all elements havebeen rendered as a single output with alpha channel. In an embodiment,an output design image 501 comprises text elements 502, 504, each ofwhich has been rendered using a background balloon that logicallysurrounds and bridges text characters. The text is “HELLO world”, butbackground color shading has been computed and attached to the textcharacters as seen in FIG. 5. A plurality of other design elements 106are present, many of which have detail that is too fine to be thesubject of a cut piece of thermal transfer film.

3. Process the OutputImage for display or print using the following subprocess. The input parameters comprise:

OutputImage, an color image with an alpha channel

FillSize, the minimum dimension, in inches, that may be cut as anegative area. This parameter is based upon the capabilities andtolerances of the computer-driven cutting equipment that is to be used,including error margins or error tolerances and to ensure that elementssuch as text are not subject to weeding in areas of fine detail.

SamplePPI, the pixels per inch of the output image.

BleedSize, the registration tolerance of cut process aligned with theprint process

MaximumNegativeRegions, the maximum number of negative areas allowed

MaximumPositiveRegions, the maximum number of positive areas allowed

The Maximum Regions parameters enforce the limitations described aboveto provide for reasonable throughput.

3.1 Resize the output image to have a border for bleed, which is thetolerance needed for the image areas to overprint the cut line. Substeps include:

Fill the bleed border with transparent white

Fill the transparent areas of the image with the substrate color,texture, and/or pattern

Build the Cut Path

3.2 Copy the alpha channel or transparency mask to a new, 1 channelimage of the same size as the output image, this is called theMaskImage.

3.3 Digitally invert the MaskImage such that each value of apixel=1.0−pixel value. FIG. 6 illustrates a rendering of the design ofFIG. 5 in which digital inversion has been applied. As a result, ininverted design 601 of FIG. 6 certain design elements such as color text602, 604 would appear as solid black fields if rendered.

In an embodiment, the algorithm herein is implemented using applicationprograms of a service provider that collects designs from designers,collects orders from customers, and acts as a fulfillment house forcustom manufactured products that the customers may order based on thedesigns. The Zazzle service, commercially available from Zazzle, Inc.,Redwood City, Calif., is an example of such a service provider. In sucha system, designers may be given access to online computer programs orapplications that permit uploading new designs and previewing theappearance of those designs in the manufacturing process before thedesigns are committed or released to the service provider for use inactual customer orders.

Thus FIG. 6, and the other drawing figures herein through FIG. 11, mayrepresent example images that could be rendered in an online applicationof the service provider, and available to the designers, to enable thedesigners to view the appearance of designs as they will be cut andapplied to products. The views of FIG. 6 to FIG. 11, inclusive, could beavailable for display selectively by designers to preview the appearanceof their designs in the rendering and cutting process that themanufacturer will use, before the designers release or commit thedesigns to the manufacturer. In some embodiments, the images may berendered in a lower-resolution for on-screen previewing purposes withdesigners, and in high-resolution versions for use in instructingprinters or cutters. Each image shown herein also may be transformed,using known processes, into machine instructions to drive the RIPSprinters and/or plotter-cutters and therefore the images shown in thedrawing figures should be considered representative of thoseinstructions.

3.4 Filter for FillSize. Sub steps include:

Copy the MaskImage into a new 1 channel image of the same size calledthe FillImage.

Shrink the FillImage by the FillSize*SamplePPI pixels.

Grow the FillImage by the FillSize*SamplePPI pixels. FIG. 3 illustratesa rendering of the design of FIG. 6 in which this first-level growthstep has been applied.

Set each of the MaskImage pixels to the lesser value of MaskImage pixeland the FillImage pixel. FIG. 8 illustrates a rendering of the design ofFIG. 7 in which this setting step has been performed. As a result, ifthe image is rendered, then design 802 comprises a large opaque region804 that conceptually covers all parts of the original design includingfine details. This step ensures that sufficient fill area exists aroundfine details to permit physical cutting by the cutting equipment, and toaccount for cutting tolerances and errors inherent in the cuttingequipment, as well as to reduce the likelihood of tearing the positivedesign regions when tearing is performed.

Dispose of FillImage

Apply Bleed

Grow the FillImage by the BleedSize*SamplePPI pixels. FIG. 9 illustratesan example of the result of growing the image using this step. In thegrown design 902 of FIG. 9, it may be seen for example that growthresults in a thicker appearance of lines 806 of FIG. 8 in the form ofthicker lines 906 in FIG. 9.

Filter to limit negative areas. This effectively reduces the number ofareas to weed and simplifies the task of determining what parts of thebacking to remove at the time of weeding. In practice, the inventorshave found that a time to weed of greater than five minutes isundesirable in a production environment because the cutting equipmenttypically requires five minutes or less to cut a piece of film for thetypical design. Therefore, a weeding time of longer than five minuteswould begin to affect throughput time. Sub steps include:

       Invert the MaskImage (pixel = 1.0-pixel)        Add each positiveregion in the image to a list called the RegionList        Add eachpositive region in the RegionList that borders the image edge to a listcalled the BorderList.        Sort the BorderList by region area,largest to smallest.        Limit the count of the BorderList toMaximumNegativeRegions.        Render the BorderList to the MaskImage.FIG. 10 illustrates an example in which the BorderList has been renderedto the MaskImage. One result is that various inclusions 908 of thedesign of FIG. 9 are filled, as seen in design 1002 of FIG. 10.       Invert the MaskImage (pixel = 1.0-pixel). FIG. 11 illustrates anexample of the result of this inversion step.      Filter to limitpositive areas Sub steps include:        Add each positive region in theimage to a list called the RegionList        Sort the RegionList byregion area, largest to smallest.        Limit the count of theRegionList to MaximumPositiveRegions.        Render the RegionList tothe MaskImage.      Convert the MaskImage outline to a vector pathcalled the CutPath      Dispose of MaskImage    Return the CutPath.   Return the OutputImage.

At this point the CutPath may be used as a cutting guide to drivecutting equipment of the type described above for thermal transfermaterial.

The OutputImage represents the final design including positive andnegative areas and may be output to end users in digital electronicform, such as in a PDF file, or printed in hard copy form. In any ofthese forms, the OutputImage may serve as a guide for personnel who areperforming weeding of negative areas of printed thermal transfermaterial, or as a finished product guide for people who are performingquality control checks on manufactured items.

FIG. 12 illustrates an example of both final CutPath and OutputImage.FIG. 12 may be rendered as a PDF file as noted above for guidancepurposes. In the example design 1202 of FIG. 12, it will be seen that anirregular region 1204 having a color corresponding to the substrate hasbeen constructed around all areas of the design, including fine printeddetails 506 and text 502, 504. The region 1204 in effect represents aminimum area of material that can be cut using available cuttingequipment and applied to the substrate with simple weeding of the cutthermal material, while preserving all fine printed details of thedesign and without excessive or wasted thermal material surrounding thedesign.

The technique disclosed herein offers the benefit of greatly simplifyingthe weeding process for personnel who are engaged in the business ofseparating the cut thermal transfer material from backing material andapplying the separated material and its adhesive to the substrate forsubsequent thermal bonding. The weeding process does not requiredetailed picking away of backing material around complex design areasbut can be accomplished in seconds instead.

All the approaches herein may be used in combination. For example, theCAD-Cut process might be effectively applied to a process but a designeror manufacturing representative might decide that certain areas thathave been designated with the substrate color ought to be removed. Anexample would be where the substrate has a texture that does not closelymatch the smooth film that will be applied over it, so that film in thecolor of the substrate does not look like the substrate due to thetexture of the actual substrate. In that case, the manufacturer ordesigner may wish to use the CAD-Cut process in combination with theACTAF process or Flex-Flock process previously described.

5. Appendix—ACTAF Disclosure

The present disclosure generally relates to computer systems used tocontrol a specialized device for cutting thermal adhesive films. Thedisclosure specifically relates to computer systems that are programmedto generate cutting and attachment instructions for a thermal transferfilm cutting device.

BACKGROUND The approaches described in this section are approaches thatcould be pursued, but not necessarily approaches that have beenpreviously conceived or pursued. Therefore, unless otherwise indicated,it should not be assumed that any of the approaches described in thissection qualify as prior art merely by virtue of their inclusion in thissection.

Plastic films with thermal adhesive backings are used for decorating awide variety of materials and products. While these films are sometimesreferred to as heat transfer vinyl, modern heat transfer films areusually manufactured from urethane, polyester, or polypropylene to avoidthe toxicity of vinyl chloride when exposed to heat.

Cut thermal adhesive films are composed of at least two layers, theplastic substrate, and a thermal adhesive coating. The substrate oftencontains a colorant or additional decorative additives. The films areusually affixed to a backing paper or plastic substrate. Films of thistype may be cut with a plotter/cutter machine so that regions of the cutfilm may describe lettering or a decorative shape or image. Often thefilms are cut in a manner that leaves the backing film or paper intact.The type of cutting is called a ‘kiss cut’.

After cutting, the portions of the film that do not include thelettering or shape to be transferred must be removed. Thenon-transferred portion of the film is called the ‘negative area’.Removing the negative areas of the film for all but the simplest designsis performed by heat press operators as a manual process. The manualremoval of negative areas of heat transfer films is called ‘weeding’.After weeding, the positive areas of the film are transferred using aheat press to the surface of the material or product to be decorated.

The labor costs for weeding constrains the complexity of designs thatmay be used for decorating objects with heat transfer films. While thereare other processes such as pad printing, screen printing, and directinkjet printing that may easily handle complex designs, heat transferfilms may be formulated to adhere to and decorate a much wider varietyof materials and combination of materials found in products than otherdecorative printing processes. Heat transfer films may also bemanufactured with metal films or flakes, or be embossed to form otheroptically active surfaces.

While automated processes exist for selective weeding, each processsuffers from significant drawbacks as described below.

One method for removing negative design areas prior to heat transfer islaser weeding. Laser weeding involves using laser ablation to removenegative design areas. Laser ablation is a process by which a portion ofa material is removed by rapidly heating the material with light from alaser so that a portion of the material is converted directly from asolid to gas. Specialty films have to be manufactured to use the lasercutting and ablation process. The heat transfer film is manufactured sothat its transfer characteristics are preserved, and is designed tominimize the toxicity of the gas resulting from ablation.

The laser weeding method contains significant drawbacks. Films withlarge variation in surface may be difficult to process. The reflectiveproperties of the film must be designed so that laser ablation may takeplace. Because the films require specialized designs, many metallic orholographic films are difficult or impossible to weed in this manner.Additionally, laser ablation requires that the full negative area betraversed, rather than just the cut edge. This can greatly increase thecutting time for processing thermal transfer films. Thus, laser weedingis constrained to small designs using a constrained set of colors andsurfaces.

Another method for removing negative design areas is selective thermaltransfer. Selective thermal transfer involves designing a pigmented filmthat separates easily when a portion of it is subjected to selectiveheat application. A printing process may transfer pigmented waxes orthermoplastics directly from a carrier sheet or ribbon to a substrate.Specialty transfer materials may be manufactured with transferable dots,segments, or regions.

The selective thermal transfer technique also contains significantdrawbacks. Because of the requirement for specially designed materials,certain types of optical effects are difficult to achieve. Additionally,constraints are placed on the durability of the material used for thetransfer. Selective thermal transfer may also be imprecise and mayresult in broken or approximate edges for the transferred design.Finally, while heat presses can be created that conform to a variety ofshapes and curvatures, building a machine for selective application ofheat transfer for custom shapes or surfaces may be prohibitivelyexpensive.

Masked thermal transfers may also be used to block the transfer ofnegative design areas. Using a masked thermal transfer is similar to theselective thermal transfer in that it involves using a film thatseparates easily when a portion of it is subjected to selective heatapplication. Masked thermal transfer also involves producing or printinga mask which can block the application of the negative portions of adesign from the substrate. As with selective thermal transfer, maskedthermal transfer techniques are constrained in the types of materialthat may be used to create the designs, thus limiting the durability andoptical effects of the design.

Given the versatility of heat transfer films, it is useful to devise asystem and method for the automated removal, or weeding, of the negativedesign areas prior to heat transfer that is integrated into theapplication of the cut thermal transfer film and that can be appliedaccurately to a large range of materials.

DETAILED DESCRIPTION In the following description, for the purposes ofexplanation, numerous specific details are set forth in order to providea thorough understanding of the present disclosure. It will be apparent,however, that embodiments may be practiced without these specificdetails. In other instances, well-known structures and devices are shownin block diagram form in order to avoid unnecessarily obscuring thepresent disclosure.

GENERAL OVERVIEW. A system and method for causing a specialized deviceto cut and weed a cut thermal transfer film is provided. In anembodiment, a service provider computer receives a request for one ormore designs to be attached to a substrate. The service providercomputer uses the design to generate additional instructions for athermal transfer film cutting device that describe regions of thethermal transfer film to be cut to create the one or more designs,regions of the thermal transfer film to be cut to provide a registrationmeans, and regions of the thermal transfer film to be attached to areceiving sheet. The service provider computer sends the additionalinstructions to the thermal transfer film cutting device which executesthe instructions on a thermal transfer film.

Aspects of the disclosure generally relate to computer-implementedtechniques for generating instructions for a device to remove negativeareas from one or more designs. In an embodiment, a service providercomputer receives one or more designs and generates instructions for acutting device. The instructions may include one or more of: cuttinginstructions, registration instructions, or attachment instructions. Theservice provider computer transmits the instructions to a cuttingdevice. Based on the instructions, the cutting device cuts one or moreshapes into the film to create the one or more designs. The cuttingdevice also cuts the film to create a registration means. The cuttingdevice then attaches a receiving sheet to the negative portions of thedesign so that the negative portions of the design can be easily removedwith the receiving sheet.

In an embodiment, a data processing method comprises receiving, at aservice provider computer over a network, design data defining one ormore designs; generating, at the service provider computer, a digitallyprogrammed set of cutting instructions for a cutting device thatdescribe regions of a film to be cut based on the design data;generating, at the service provider computer, a digitally programmed setof registration instructions for the cutting device that describeregions of a film to cut to create a registration means; generating, atthe service provider computer, a digitally programmed set of attachmentinstructions for the cutting device that describe regions of a film tobe attached to a receiving sheet; transmitting, from the serviceprovider computer, the attachment instructions, the cutting instructionsand the registration instructions to the cutting device; whereinexecuting the cutting instructions and registration instructions usingone or more processors of the cutting device causes performing: causinga cutting means of the cutting device to cut a film on a backing sheetinto the one or more designs based on the cutting instructions; causingthe cutting means of the cutting device to cut the film and the backingsheet to provide a registration means based on the registrationinstructions; causing the cutting device to attach one or more unusedportions of the one or more designs to the receiving sheet using anattachment means based on the attachment instructions.

In an alternate embodiment, a data processing method comprisesreceiving, at a service provider computer over a network, design datadefining one or more designs; generating, at the service providercomputer, a digitally programmed set of cutting instructions for acutting device that describe regions of a film to be cut based on thedesign data; generating, at the service provider computer, a digitallyprogrammed set of registration instructions for the cutting device thatdescribe regions of a film to cut to create a registration means;generating, at the service provider computer, a digitally programmed setof attachment instructions for the cutting device that describe regionsof a film to be attached to a receiving sheet; transmitting, from theservice provider computer, the attachment instructions, the cuttinginstructions and the registration instructions to the cutting device;wherein executing the cutting instructions and registration instructionsusing one or more processors of the cutting device causes performing:causing a cutting means of the cutting device to cut a film on a backingsheet into the one or more designs based on the cutting instructions;wherein the film comprises printed indicia corresponding to the one ormore designs; causing the cutting means of the cutting device to cut thefilm and the backing sheet to provide a registration means based on theregistration instructions; causing the cutting device to attach the oneor more designs to the transfer sheet using an attachment means based onthe attachment instructions.

Other features and aspects of the disclosure will become apparent in thedrawings, description, and the claims.

STRUCTURAL OVERVIEW. FIG. 1A is an example data flowchart depicting aninfrastructure for automatically cutting a design on thermal transferfilm using one or more computing devices.

Customer computer 120, design computer 130, and service providercomputer 140 are communicatively coupled over network 110. In thisarrangement, the computers may form a system that is configured orprogrammed to enable a customer that is associated with customercomputer 120 to order custom printed products from a service providerthat is associated with the service provider computer 140, and basedupon designs that have been contributed to the service provider computeror an associated database by a designer that is associated with thedesign computer 130. The ZAZZLE service, commercially available fromZazzle Inc., Redwood City, Calif., is one example of a commercialembodiment of such a service.

Computers 120, 130, and 140 may be coupled using any of a LAN, WAN, orone or more internetworks, and each arrow shown in FIG. 1A with astraight line may represent a network link using any of a LAN, WAN, orone or more internetworks. Customer computer 120 may be a laptop,netbook, personal computer, mobile phone, smartphone, tablet, portableelectronic device, or workstation associated with an individual user.Design computer 130 and service provider computer 140 may beserver-class computers or multiple computers in a data center. Serviceprovider computer 140 may be communicatively coupled to thermal transferfilm cutting device 150 through one or more wireless or wiredconnections.

Design computer 130 may contain one or more files containing design datafor one or more designs. Design data may indicate positive and negativeareas of the design. In an embodiment, design data also includesprinting instructions, such as color and design placement for a thermaltransfer film.

Design data may be uploaded to one or more databases associated withservice provider computer 140 under the direction of designers. Theservice provider computer 140 may review and approve the designs andmake them available in an online catalog of available customizableproducts that customers may order. Customer computer 120 may interactwith service provider computer 140 to display the one or more designs toa user of customer computer 120. When customer computer 120 receivesinput selecting one or more designs or customizable products, customercomputer 120 may send the request for one or more designs to serviceprovider computer 140.

Service provider computer 140 is coupled to a thermal transfer filmcutting device 150, which may be programmed or configured withinstructions to cause automatic computer-controlled cutting of thermaltransfer film 160 to produce cut film 170. The cut film 170 then may bemanually applied to a substrate 180 and thermally bonded to thesubstrate to produce a finished decorated product, including customizedor personalized products. Examples of substrate 180 include wearingapparel, hats, bags, and toys.

FIG. 1B illustrates an example logic architecture of the serviceprovider computer. In one embodiment, service provider computer 140 isprogrammed or configured with functional logic that may be used tofacilitate a method for automatically cutting a design on thermaltransfer film.

In one embodiment, service provider computer 140 contains presentationlayer/user interface logic 142, web server 144, device driver 145, cutpath generation logic 146, and design storage 148. Presentationlayer/user interface logic 142 and web server 144 are programmed tointeract with customer computer 120 and can access design storage 148.Device driver 145 is programmed to interact with thermal film cuttingdevice 150 and can access design storage 148. Cut path generation logic146 is coupled to web server 144, device driver 145, and design storage148. Each of the foregoing elements is further described in structureand function in other sections herein. Service provider computer 130also may include other devices, components, or elements of a computersystem such as volatile or non-volatile memory, non-volatile storagesuch as disk, and I/O devices as seen and described, for example, inconnection with FIG. 4. For purposes of illustrating a clear example,only those logical elements relevant to the present invention are shownand other embodiments may implement many other kinds of functional logicfor other purposes, features or aspects of service.

Service provider computer 140 may be programmed to interact withcustomer computer 120 through presentation layer/user interface logic142. Presentation layer/user interface logic 142 may be programmed orconfigured to present one or more design options to a user of customercomputer 120 and to receive requests for one or more designs from thecustomer computer, and may adapt presentation of this information to thetype of device represented by customer computer 120. For example, anonline catalog may be supported that enables a user to browse a largenumber of available customizable products, select one product ofinterest, select a design to be applied to the product, select color,size or other parameters for customization, and place an order for thecustomizable product. Presentation layer/user interface logic 142 mayretrieve designs from design storage 148 to display to customercomputing device 120 as part of the browsing or ordering process andproduce device-specific user interface screen displays or similarinformation.

Service provider computer 140 may interact with design computer 130through web server 144. Web server 144 may be configured to receivedesign data for one or more designs from design computer 130 when adesigner elects to upload the design data to the service providercomputer 140. Additionally, web server 144 may periodically makerequests to design computer 130 for new design data relating to newdesigns. Web server 144 may cause design data to be stored in designstorage 148. Web server 144, or other logic, may be programmed toimplement a review workflow under which personnel associated with theservice provider computer 140 may review and approve designs before thedesign data is released to the online catalog for use in customizedproduct orders.

In some embodiments, when web server 144 receives one or more ordersthat specify particular designs, web server 144 may send the one or moredesigns to cut path generation logic 146. Alternatively, cut pathgeneration logic 146 may retrieve the one or more designs from designstorage in response to receiving an indication that presentationlayer/user interface logic 142 received a request from customer computer120 to order one or more products with particular designs.

Cut path generation logic 146 may be configured or programmed togenerate instructions for thermal transfer film cutting device 150 usingdesign data received from design storage 158. In some embodiments, cutpath generation logic 146 uses a numerical control language, such asG-Code statements, to create cutting instructions for cutting device150. G-Code is a language for numerical control of devices such as NCdrilling machines and routers. G-Code consists of statements directingthe 3-D motion of a machine. Cut path generation logic 146 may generatea cut path for a cutting means of thermal transfer film cutting device150 using G-Code or similar languages. Cut path generation logic 146 maymodify the cut path for the design based on the material used.

Cut path generation logic 146 may also generate registrationinstructions for thermal transfer film cutting device 150. Registrationinstructions may include data indicating how to cut portions of the filmto provide a registration means for the receiving sheet. For example, aseries of holes in specified locations may be cut so that the holes willsnugly fit over corresponding pins in a platen of the device 150; thelocations of these pins or other registration means may vary dependingon the device and therefore the instructions may be programmed toconform to the location and type of registration means used with aparticular device. Cut path generation logic 146 may be configured todetermine one or more unused portions of the design to use for theregistration means. That is, based upon data specifying a geometriclocation on the platen of the cutting device 150 that contains theregistration means, the cut path generation logic 146 may adjustpositioning of the cut path for the design so that cuts for theregistration means can be accommodated. In some embodiments, cut pathgeneration logic 146 stores the cutting instructions and registrationinstructions in design storage 148.

Design storage 148 may be configured or programmed to store design datarelating to one or more designs received from designer computer 130 andinstructions generated by cut path generation logic 146. The designstorage 148 may comprise one or more tables or files that are integratedwith data storage devices or databases that support other aspects of thesystem and separate dedicated design storage or instruction storage isnot required. Design data may include a mapping of design elements, oneor more images, or one or more instructions for image generation. Designdata may be stored as individual files, in data structures in memory, inrows in a database table, in flat files or spreadsheets, or other formsof digitally stored data. Design storage 148 may include a database ofdesigns indexed by unique design identifiers.

As used herein, the term “database” may refer to either a body of data,a relational database management system (RDBMS), or to both. As usedherein, a database may comprise any collection of data includinghierarchical databases, relational databases, flat file databases,object-relational databases, object oriented databases, and any otherstructured collection of records or data that is stored in a computersystem. Examples of RDBMS's include, but are not limited to including,Oracle® Database, MySQL, IBM® DB2, Microsoft® SQL Server, Sybase®, andPostgreSQL. However, any database may be used that enables the systemsand methods described herein.

Service provider computer 140 may interact with device 150 throughdevice driver 145. Device driver 145 may be configured or programmed tosend cutting instructions and registration instructions to thermaltransfer film cutting device 150. Device driver 145 may receive thecutting instructions and registration instructions from cut pathgeneration logic 146 or design storage 148. In some embodiments, devicedriver 145 receives cutting and registration instructions for aparticular image from cut path generation logic 146 the first time theparticular image is selected and from design storage 148 for eachsubsequent selection.

Thermal transfer film cutting device 150 may comprise one or moreprocessors, a registration means, a cutting means, and an attachmentmeans. The one or more processors may be configured or programmed toexecute instructions received by service provider computer 140. In someembodiments, the one or more processors may be configured to receivedesign data and generate instructions based on the design data.

The registration means may be any method of holding thermal transferfilm in a position that is fixed in relation to the cutting device inorder to attach either a receiver sheet or a transfer sheet to thethermal transfer film in the same orientation. In an embodiment, theregistration means is a flat aluminum platen with upwardly protrudingregistration pins that may engage or snugly grip corresponding holes inthe film and sheets so that a stack consisting of the film and sheets isin fixed alignment. The registration means may also have a cut channelthat is bigger than the maximum size of the transfer film to beprocessed but smaller than the receiver sheet. In an alternativeembodiment, the registration means is a set of rollers that hold thethermal transfer film against a platen and which determines the positionof the transfer film by optically detecting holes in the thermaltransfer film that were created by the cutter.

The cutting means may be any method of cutting a design onto a thermaltransfer film. In an embodiment, the cutting means is a sharp implementsuch as a needle or knife blade attached to a gantry robot that iscontrolled by a microcontroller. The cutting means may be used to tracea path on a thermal transfer film as described by the cuttinginstructions received from service provider computer 140. The cuttingmeans may also be used to cut the transfer film in specific areas toprovide a registration means. For example, the cutting means may beconfigured to cut holes for the registration pins described above. Asanother example, the cutting means may be configured to cut holes in thetransfer film to be detected by the set of rollers described above.

The attachment means may be any method of attaching a receiving sheet ora transfer sheet to a thermal transfer film. In an embodiment, theattaching means is a thermal point source. The thermal point source maybe a heat conductive material, such as copper, shaped to have a smoothpoint. Heat may be applied to the copper point using heat generated byelectrical resistance. A modified or unmodified soldering iron could beused as the thermal point source. The thermal point source may beattached to a gantry with servo motors to position and control the heatsource. In another embodiment, the registration means includes a set ofrollers that move the thermal transfer film in one or more directionsand the thermal point source is attached to a carriage that moves thethermal point source in one direction and a servo mechanism that movesthe thermal point source towards or away from the thermal transfer filmand applies pressure.

A heat sensor may be used to measure the heat of the thermal pointsource in order to maintain the temperature of the thermal point sourceat a given temperature. The given temperature may be set to thetemperature needed to attach the thermal adhesive of the transfer filmsto a receiver sheet within a set distance from the center of the heatsource.

THERMAL TRANSFER FILM CUTTING AND WEEDING. FIG. 2 is an example dataflowchart for a method of automatically cutting a design on thermaltransfer film.

At step 202, the process reads instructions that describe regions of afilm to cut. For example, service provider computer 140 readsinstructions that describe regions of a film to cut. At a basic level,the instructions may be a design in an image file, a PDF file, or anyother type of document. More complicated instructions may definenegative and positive portions of a design and areas of the design tocut.

At step 204, the process generates additional instructions that describehow to cut a film to create a design. For example, service providercomputer 140 generates additional instructions for an automated device,such as thermal transfer film cutting device 150, that describes how tocut the film to create the design. As discussed above, generatingadditional instructions may include creating instructions in a numericalcontrol language, such as G-Code, that define the movements of thecutting means of thermal transfer film cutting device 150.

At step 206, the process generates additional instructions that describehow to cut a registration means onto a film. For example, serviceprovider computer 140 generates additional instructions for an automateddevice, such as thermal transfer film cutting device 150, that describehow to cut a registration means onto the film. The instructions for theregistration means may be pre-programmed into service provider computer140 and merely added to the instructions for cutting the film to createthe design. In some embodiments, the instructions for the registrationmeans are uniform for each design. For example, the instructions maydefine the corners of the thermal transfer film as the location for theregistration means. In other embodiments, service provider computer 140determines one or more locations on the thermal transfer film that donot overlap with the design for the placement of the registration means.In an embodiment, service provider computer 140 generates instructionsto cut markings, such as holes, into the thermal transfer film that canbe optically detected by one or more rollers of thermal transfer filmcutting device 150.

At step 208, the process generates additional instructions that describewhere to attach a receiving sheet to a film. For example, serviceprovider computer 140 generates additional instruction for an automateddevice, such as thermal transfer film cutting device 150, that describewhere to attach the receiving sheet to the film. In some embodiments, areceiving sheet is used by thermal transfer film cutting device 150 toremove negative areas from a design, as will be discussed below. Serviceprovider computer 140 may determine the locations of the negative areasof the design and generate instructions for the attachment means toattach the receiving sheet to the negative areas. In other embodiments,a transfer sheet is used to remove the design from the negative areas ofthe design. Service provider computer 140 may determine the locations ofthe design on the thermal transfer film and generate instructions forthe attachment means to attach the transfer sheet to the design areas.

In an embodiment, the instructions generated in step 208 are derivedfrom the instructions generated in step 206. For example, theinstructions generated in step 206 may be a path or vector for thecutting means to follow. The areas for attachment, as described below,may follow a similar path as the path or vector for the cutting means,but offset by a specified value. For example, if the path or vector forthe cutting means describes a circle with the positive design regionsinside the circle, the path of the attachment means may describe alarger circle centered on the first circle. Thus, the path for theattachment means would be the initial circle, but offset by a specifiedvalue.

At step 210, the process generates additional instructions that describehow to apply heat to a film. For example, service provider computer 140generates addition instructions for an automated device, such as thermalfilm cutting device 150, that describe a location and magnitude of heatto apply to the film. Thermal transfer film cutting device 150 mayattach the receiving sheet to the thermal transfer film by applying heatto the transfer film in precise locations. Application of heat to attachthe receiving sheet to the thermal transfer film is described in greaterdetail below. Service provider computer 140 may generate instructionsthat determine the locations at which to apply heat and the amount ofheat to apply in order to create an ideal attachment of the receivingsheet to the thermal transfer film. Generation of these instructions maybe based on the instructions generated in step 208 which determine theareas of the thermal transfer film to attach to the receiving sheet.

At step 212, the process cuts a design on a backing sheet. For example,thermal transfer film cutting device 150 uses the instructions generatedin step 204 to cut a film on a backing sheet to describe the decorativedesign.

FIG. 3A depicts a thermal transfer film with a cut out design. Thermaltransfer film 160 comprises film layer 302 and backing sheet 304. Filmlayer 302 may be coated with a thermal adhesive coating. In anembodiment, the cutting means used to cut transfer film 160 cuts filmlayer 302 without cutting backing sheet 304. Film layer 302 containsdesign 306. While design 306 is depicted as a printed design, in someembodiments design 306 may be an outline of a design. Design 306 mayalso include negative areas within the design. For example, the darkportions of the eyes in design 306 may be defined as a negative area ofthe design to be removed.

Thermal transfer film 160 also comprises negative region 308. Negativeregion 308 is an unused portion of thermal transfer film 160. Whiletransfer film 160 is depicted as containing a single negative region, invarious embodiments a design may contain a plurality of negativeregions. The unused portion is the area that has been determined to notbe a part of the overall design. For example, the chosen design in FIG.3A may include a small area around the displayed face as a buffer zone.The small area would not be considered part of negative region 308.

Referring again to FIG. 2, at step 214, the process cuts a film andbacking sheet to provide a registration means. For example, thermaltransfer film cutting device 150 uses the instructions generated in step206 to cut thermal transfer film 160 and backing sheet 304 to provide aregistration means. Registration holes 310 are cut into thermal transferfilm 160 to provide a method for attaching thermal transfer film 160 tothermal transfer film cutting device 150. Registration holes 310 may becuts or marking that are capable of providing thermal transfer filmcutting device 150 with a registration means.

After registration holes 310 are cut into thermal transfer film 160,thermal transfer film 160 may be attached to the registration means ofthermal transfer film cutting device 150. In an embodiment, attachingthe thermal transfer film to the registration means is a manual process.For example, the registration means may have pins in locations thatcorrespond to registration holes 310 on the thermal transfer film. Aperson may place the thermal transfer film over the registration meansso that the pins line up with registration holes 310.

At step 216, the process attaches a receiving sheet to a film. Forexample, thermal transfer film cutting device 150 uses the instructionsgenerated in step 208 to attach the receiving sheet to thermal transferfilm 160. FIG. 3B depicts a receiving sheet being attached to thethermal transfer film of FIG. 3A. FIG. 3B includes thermal transfer film160 and receiving sheet 312. Thermal transfer film cutting device 150may use the registration means, such as registration holes 310 forexample, and the instructions generated in step 208 to determine theplacement of receiving sheet 312.

In an embodiment, attaching receiving sheet 312 to thermal transfer film160 involves applying heat to specific portions of thermal transfer film160. Applying heat to thermal transfer film 160 causes the thermaladhesive coating to attach to receiving sheet 312. The thermal pointsource of thermal transfer film cutting device 150 may apply heat toprecise areas, causing only specific portions of thermal transfer film160 to attach to receiving sheet 312. In this manner, thermal transferfilm cutting device 150 may cause only negative region 308 to attach toreceiving sheet 312.

To attach thermal transfer film 160 to a receiving sheet 312, theattachment means applies enough heat to negative region 308 to causenegative region 308 to attach to receiving sheet 312 without applyingenough heat to attach the adjacent positive regions of design 306. Thus,in some areas a higher heat may be utilized to attach a larger portionof thermal transfer film 160 to receiving sheet 312 while in other areasa lower heat may be utilized to attach a smaller portion of thermaltransfer film 160 to receiving sheet 312. The attachment resolution ofthermal transfer film cutting device 150 may constrain the size ofnegative areas that may be removed. For example, if the finestattachment resolution for the thermal transfer film cutting device 150is 0.5 millimeters, then thermal cutting device may apply the thermalpoint source to locations that are at least 0.5 millimeters away fromdesign 306.

Additionally, the minimum attachment point for a thermal point source istwice the attachment resolution. A thermal point source with anattachment resolution of 0.5 millimeters would attach a 1 millimeterwide dot of thermal transfer film 160 to receiving sheet 312.

Service provider computer 140 may take into account the attachmentresolution of thermal transfer film cutting device 150 in creatinginstructions for attaching thermal transfer film 160 to receiving sheet312. Additionally, service provider computer 140 may be configured todetermine the minimum tear span for the type of thermal transfer filmused. While some thermal transfer films may separate easily, others maytear when negative region 308 is removed from thermal transfer film 160.A minimum tear span, defining the maximum distance between attachmentpoints of a specific thermal transfer film that will not cause a tearwhen separated, may be defined for each type of thermal transfer film.Service provider computer 140 may be configured to create a path thatattaches negative region 308 to receiving sheet 312 in a manner suchthat the distance between two attachment points does not drop below theminimum tear span.

Attaching the unused portions of the decorative design to the receivingsheet in step 216 may thus comprise thermal transfer film cutting device150 tracing a path of heat along the edges of negative region 308,offset by the attachment resolution of the thermal point source andseparated by a maximum distance of the minimum tear span. Thermaltransfer film cutting device 150 then outputs the combined thermaltransfer film with negative region 308 attached to receiving sheet 312.

In an embodiment, a manual process involves removing negative region 308from thermal transfer film 160. FIG. 3C depicts the receiver sheet beingused to remove the negative areas of the design on the transfer film ofFIG. 3A. In FIG. 3C, a person removes receiving sheet 312 from thermaltransfer film 160. Negative region 308 can be removed with receivingsheet 312 due to the attachment created in step 216. Since design 306has been cut away from negative region 308, design 306 is not removedwhen receiving sheet 312 is separated.

In some embodiments, the cutting means only cuts film layer 302 ofthermal transfer film 160. When receiving sheet 312 is removed fromthermal transfer film 160, negative region 308 is also removed frombacking sheet 304. In these embodiments, the result of removing negativeregion 308 with receiving sheet 312 is design 306 on backing sheet 304,as shown in FIG. 3C. In other embodiments, backing sheet 304 is also cutby the cutting means. In those embodiments, cut film 170 includes design306 on backing sheet 304 cut into the same shape as design 306, as shownin FIG. 1A.

Once the negative region 308 has been removed from thermal transfer film160, cut film 170 may be attached to substrate 180. Substrate 180 may beany base material that is capable of being attached to cut film 170,including fabrics, textiles, plastic substrates, or paper. Using a heatpress device, a person may attach cut film 170 to substrate 180.

OTHER EMBODIMENTS. In many embodiments, thermal transfer film 160contains a thermal adhesive coating that faces away from backing sheet304. In some embodiment, a thermal transfer film which accepts inkjetprinting is used, allowing a design to be pre-printed on the thermaltransfer film before the weeding process. Different methods may be usedfor transferring the pre-printed designs depending on whether thebacking sheet can accept thermal attachment to the negative design areasof the design.

In an embodiment, the backing sheet is capable of accepting thermalattachment to the negative design areas of the design. Thermal transferfilm 160 may include film layer 302 with a thermal adhesive coating thatfaces backing sheet 304 and a printed side that faces away from backingsheet 304. After thermal transfer film cutting device 150 cuts design306 and registration holes 310 into thermal transfer film 160, thermaltransfer film 160 may be attached to the registration means of thermaltransfer film cutting device 150. Thermal transfer film cutting device150 may use a thermal point source to attach negative region 308 tobacking sheet 304. A transfer sheet that is coated with a repositionableadhesive may be pressed firmly to design 306 to cause the transfer sheetto adhere to design 306. The transfer sheet may then be used to removedesign 306 from negative region 308 and backing sheet 304. The transfersheet may then be used to align design 306 with substrate 180. Design306 may be attached to substrate 180 through use of a heat press. Thetransfer sheet may then be removed from design 306.

In an alternative embodiment, the backing sheet is not capable ofaccepting thermal attachment to the negative design areas of the design.Thermal transfer film cutting device 150 may attach negative region 308to receiving sheet 312 in a similar manner as described above. Receivingsheet 312 may then be used to remove negative region 308 from thermaltransfer film 160. A transfer sheet that is coated with a repositionableadhesive may be pressed firmly to design 306 to cause the transfer sheetto adhere to design 306. The transfer sheet may then be used to removedesign 306 from backing sheet 304. The transfer sheet may then be usedto align design 306 with substrate 180. Design 306 may be attached tosubstrate 180 through use of a heat press. The transfer sheet may thenbe removed from design 306.

HARDWARE OVERVIEW. According to one embodiment, the techniques describedherein are implemented by one or more special-purpose computing devices.The special-purpose computing devices may be hard-wired to perform thetechniques, or may include digital electronic devices such as one ormore application-specific integrated circuits (ASICs) or fieldprogrammable gate arrays (FPGAs) that are persistently programmed toperform the techniques, or may include one or more general purposehardware processors programmed to perform the techniques pursuant toprogram instructions in firmware, memory, other storage, or acombination. Such special-purpose computing devices may also combinecustom hard-wired logic, ASICs, or FPGAs with custom programming toaccomplish the techniques. The special-purpose computing devices may bedesktop computer systems, portable computer systems, handheld devices,networking devices or any other device that incorporates hard-wiredand/or program logic to implement the techniques.

For example, FIG. 4 is a block diagram that illustrates a computersystem 400 upon which embodiments may be implemented. Computer system400 includes a bus 402 or other communication mechanism forcommunicating information, and a hardware processor 404 coupled with bus402 for processing information. Hardware processor 404 may be, forexample, a general purpose microprocessor.

Computer system 400 also includes a main memory 406, such as a randomaccess memory (RAM) or other dynamic storage device, coupled to bus 402for storing information and instructions to be executed by processor404. Main memory 406 also may be used for storing temporary variables orother intermediate information during execution of instructions to beexecuted by processor 404. Such instructions, when stored innon-transitory storage media accessible to processor 404, rendercomputer system 400 into a special-purpose machine that is customized toperform the operations specified in the instructions.

Computer system 400 further includes a read only memory (ROM) 408 orother static storage device coupled to bus 402 for storing staticinformation and instructions for processor 404. A storage device 410,such as a magnetic disk, optical disk, or solid-state drive is providedand coupled to bus 402 for storing information and instructions.

Computer system 400 may be coupled via bus 402 to a display 412, such asa cathode ray tube (CRT), for displaying information to a computer user.An input device 414, including alphanumeric and other keys, is coupledto bus 402 for communicating information and command selections toprocessor 404. Another type of user input device is cursor control 416,such as a mouse, a trackball, or cursor direction keys for communicatingdirection information and command selections to processor 404 and forcontrolling cursor movement on display 412. This input device typicallyhas two degrees of freedom in two axes, a first axis (e.g., x) and asecond axis (e.g., y), that allows the device to specify positions in aplane.

Computer system 400 may implement the techniques described herein usingcustomized hard-wired logic, one or more ASICs or FPGAs, firmware and/orprogram logic which in combination with the computer system causes orprograms computer system 400 to be a special-purpose machine. Accordingto one embodiment, the techniques herein are performed by computersystem 400 in response to processor 404 executing one or more sequencesof one or more instructions contained in main memory 406. Suchinstructions may be read into main memory 406 from another storagemedium, such as storage device 410. Execution of the sequences ofinstructions contained in main memory 406 causes processor 404 toperform the process steps described herein. In alternative embodiments,hard-wired circuitry may be used in place of or in combination withsoftware instructions.

The term “storage media” as used herein refers to any non-transitorymedia that store data and/or instructions that cause a machine tooperate in a specific fashion. Such storage media may comprisenon-volatile media and/or volatile media. Non-volatile media includes,for example, optical disks, magnetic disks, or solid-state drives, suchas storage device 410. Volatile media includes dynamic memory, such asmain memory 406. Common forms of storage media include, for example, afloppy disk, a flexible disk, hard disk, solid-state drive, magnetictape, or any other magnetic data storage medium, a CD-ROM, any otheroptical data storage medium, any physical medium with patterns of holes,a RAM, a PROM, and EPROM, a FLASH-EPROM, NVRAM, any other memory chip orcartridge.

Storage media is distinct from but may be used in conjunction withtransmission media. Transmission media participates in transferringinformation between storage media. For example, transmission mediaincludes coaxial cables, copper wire and fiber optics, including thewires that comprise bus 402. Transmission media can also take the formof acoustic or light waves, such as those generated during radio-waveand infra-red data communications.

Various forms of media may be involved in carrying one or more sequencesof one or more instructions to processor 404 for execution. For example,the instructions may initially be carried on a magnetic disk orsolid-state drive of a remote computer. The remote computer can load theinstructions into its dynamic memory and send the instructions over atelephone line using a modem. A modem local to computer system 400 canreceive the data on the telephone line and use an infra-red transmitterto convert the data to an infra-red signal. An infra-red detector canreceive the data carried in the infra-red signal and appropriatecircuitry can place the data on bus 402. Bus 402 carries the data tomain memory 406, from which processor 404 retrieves and executes theinstructions. The instructions received by main memory 406 mayoptionally be stored on storage device 410 either before or afterexecution by processor 404.

Computer system 400 also includes a communication interface 418 coupledto bus 402. Communication interface 418 provides a two-way datacommunication coupling to a network link 420 that is connected to alocal network 422. For example, communication interface 418 may be anintegrated services digital network (ISDN) card, cable modem, satellitemodem, or a modem to provide a data communication connection to acorresponding type of telephone line. As another example, communicationinterface 418 may be a local area network (LAN) card to provide a datacommunication connection to a compatible LAN. Wireless links may also beimplemented. In any such implementation, communication interface 418sends and receives electrical, electromagnetic or optical signals thatcarry digital data streams representing various types of information.

Network link 420 typically provides data communication through one ormore networks to other data devices. For example, network link 420 mayprovide a connection through local network 422 to a host computer 424 orto data equipment operated by an Internet Service Provider (ISP) 426.ISP 426 in turn provides data communication services through the worldwide packet data communication network now commonly referred to as the“Internet” 428. Local network 422 and Internet 428 both use electrical,electromagnetic or optical signals that carry digital data streams. Thesignals through the various networks and the signals on network link 420and through communication interface 418, which carry the digital data toand from computer system 400, are example forms of transmission media.

Computer system 400 can send messages and receive data, includingprogram code, through the network(s), network link 420 and communicationinterface 418. In the Internet example, a server 430 might transmit arequested code for an application program through Internet 428, ISP 426,local network 422 and communication interface 418.

The received code may be executed by processor 404 as it is received,and/or stored in storage device 410, or other non-volatile storage forlater execution.

OTHER DISCLOSURE. The following numbered clauses provide furtherdisclosure and are not intended as formal claims.

1. A method comprising: receiving, at a service provider computer over anetwork, design data defining one or more designs; generating, at theservice provider computer, a digitally programmed set of cuttinginstructions for a cutting device that describe regions of a film to becut based on the design data; generating, at the service providercomputer, a digitally programmed set of registration instructions forthe cutting device that describe regions of a film to cut to create aregistration means; generating, at the service provider computer, adigitally programmed set of attachment instructions for the cuttingdevice that describe regions of a film to be attached to a receivingsheet; transmitting, from the service provider computer, the attachmentinstructions, the cutting instructions and the registration instructionsto the cutting device; wherein executing the cutting instructions andregistration instructions using one or more processors of the cuttingdevice causes performing: causing a cutting means of the cutting deviceto cut a film on a backing sheet into the one or more designs based onthe cutting instructions; causing the cutting means of the cuttingdevice to cut the film and the backing sheet to provide a registrationmeans based on the registration instructions; causing the cutting deviceto attach one or more unused portions of the one or more designs to thereceiving sheet using an attachment means based on the attachmentinstructions; wherein the method is performed by one or more computingdevices.

2. The method of clause 1 wherein the attachment instructions arederived from the cutting instructions based on offsetting a vectorregion.

3. The method of clause 1 wherein the registration means comprises twoor more holes that are configured to snugly fit over two or morecorresponding pins on a platen of the cutting device.

4. The method of clause 1 wherein attaching the one or more unusedportions of the one or more designs to the receiving sheet comprises thecutting device using a thermal point source to heat a thermal adhesiveon unused portions of the one or more designs.

5. The method of clause 1: wherein the film comprises printed indiciacorresponding to the one or more designs; wherein the cutting deviceattaching the one or more unused portions of the one or more designs tothe receiving sheet comprises the cutting device attaching a printedside of the one or more unused portions of the one or more designs tothe receiving sheet with a thermal adhesive; the method furthercomprising: the one or more processors causing the cutting device toattach the printed side of the one or more designs to a transfer sheetbased on the attachment instructions.

6. A method comprising: receiving, at a service provider computer over anetwork, design data defining one or more designs; generating, at theservice provider computer, a digitally programmed set of cuttinginstructions for a cutting device that describe regions of a film to becut based on the design data; generating, at the service providercomputer, a digitally programmed set of registration instructions forthe cutting device that describe regions of a film to cut to create aregistration means; generating, at the service provider computer, adigitally programmed set of attachment instructions for the cuttingdevice that describe regions of a film to be attached to a transfersheet; transmitting, from the service provider computer, the attachmentinstructions, the cutting instructions and the registration instructionsto the cutting device; wherein executing the cutting instructions andregistration instructions using one or more processors of the cuttingdevice causes performing: causing a cutting means of the cutting deviceto cut a film on a backing sheet into the one or more designs based onthe cutting instructions; wherein the film comprises printed indiciacorresponding to the one or more designs; causing the cutting means ofthe cutting device to cut the film and the backing sheet to provide aregistration means based on the registration instructions; causing thecutting device to attach the one or more designs to the transfer sheetusing an attachment means based on the attachment instructions; whereinthe method is performed by one or more computing devices.

7. The method of clause 6 wherein the attachment instructions arederived from the cutting instructions based on offsetting a vectorregion.

8. The method of clause 6 wherein the registration means comprises twoor more holes that are configured to snugly fit over two or morecorresponding pins on a platen of the cutting device.

9. The method of clause 6 wherein attaching the one or more designs tothe transfer sheet comprises the cutting device coating the transfersheet with a repositionable adhesive and pressing a coated surface ofthe transfer sheet against the one or more designs.

10. A system comprising: a web server of a service provider computer,configured to receive, over a network, design data defining one or moredesigns; a cut path generation logic component of a service providercomputer, configured to: generate a digitally programmed set of cuttinginstructions for a cutting device that describe regions of a film to becut based on the design data; generate a digitally programmed set ofregistration instructions for a cutting device that describes regions ofa film to cut to create a registration means; generate a digitallyprogrammed set of attachment instructions for the cutting device thatdescribe regions of a film to be attached to a receiving sheet; whereinthe web server of the service provider computer is further configure totransmit the cutting instructions, the registration instructions, andthe attachment instructions to the cutting device; one or moreprocessors of the cutting device, configured to receive and execute thecutting instructions and the registration instructions; a cutting meansof the cutting device, configured to cut a film on a backing sheet intothe one or more designs based on the cutting instructions and to cut thefilm on the backing sheet to provide a registration means based on theregistration instructions; an attachment means of the cutting device,configured to attach one or more unused portions of the one or moredesigns to the receiving sheet based on the attachment instructions.

11. The system of clause 10 wherein the attachment instructions arederived from the cutting instructions based on offsetting a vectorregion.

12. The system of clause 10 wherein the registration means comprises twoor more holes that are configured to snugly fit over two or morecorresponding pins on a platen of the cutting device.

13. The system of clause 10 wherein the attachment means of the cuttingdevice is configured to attach the one or more unused portions of theone or more designs to the receiving sheet by using a thermal pointsource to heat a thermal adhesive on unused portions of the one or moredesigns.

14. The system of clause 10: wherein the film comprises printed indiciacorresponding to the one or more designs; wherein the attachment meansof the cutting device is configured to attach the one or more unusedportions of the one or more designs to the receiving sheet by attachinga printed side of the one or more unused portions of the one or moredesigns to the receiving sheet with a thermal adhesive; wherein theattachment means of the cutting device is further configured to attachthe printed side of the one or more designs to a transfer sheet based onthe attachment instructions.

15. A system comprising: a web server of a service provider computer,configured to receive, over a network, design data defining one or moredesigns; a cut path generation logic component of a service providercomputer, configured to: generate a digitally programmed set of cuttinginstructions for a cutting device that describe regions of a film to becut based on the design data; generate a digitally programmed set ofregistration instructions for a cutting device that describes regions ofa film to cut to create a registration means; generate a digitallyprogrammed set of attachment instructions for the cutting device thatdescribe regions of a film to be attached to a transfer sheet; whereinthe web server of the service provider computer is further configure totransmit the cutting instructions, the registration instructions, andthe attachment instructions to the cutting device; one or moreprocessors of the cutting device, configured to receive and execute thecutting instructions and the registration instructions; a cutting meansof the cutting device, configured to cut a film comprising printedindicia corresponding to the one or more designs on a backing sheet intothe one or more designs based on the cutting instructions and to cut thefilm on the backing sheet to provide a registration means based on theregistration instructions; an attachment means of the cutting device,configured to attach the one or more designs to the transfer sheet basedon the attachment instructions.

16. The system of clause 15 wherein the attachment instructions arederived from the cutting instructions based on offsetting a vectorregion.

17. The system of clause 15 wherein the registration means comprises twoor more holes that are snugly fit over two or more corresponding pins ona platen of the cutting device.

18. The system of clause 15 wherein the attachment means attaches theone or more designs to the transfer sheet by coating the transfer sheetwith a repositionable adhesive and pressing a coated surface of thetransfer sheet against the one or more designs.

6. Extensions and Alternatives

In the foregoing specification, embodiments of the invention have beendescribed with reference to numerous specific details that may vary fromimplementation to implementation. The specification and drawings are,accordingly, to be regarded in an illustrative rather than a restrictivesense. The sole and exclusive indicator of the scope of the invention,and what is intended by the applicants to be the scope of the invention,is the literal and equivalent scope of the set of claims that issue fromthis application, in the specific form in which such claims issue,including any subsequent correction.

What is claimed is:
 1. A method of manufacturing a tangible substratewith a thermal film that is cut according to computer instructions, themethod comprising: obtaining an input digital image of a design that isto be transferred to the tangible substrate and storing the inputdigital image in electronic digital memory of a computer; using thecomputer, rendering a plurality of design elements of the design as asingle output image; using the computer and based upon the output image,a bleed size value, a maximum number of negative areas, a maximum numberof positive areas, and one or more substrate attribute values: resizingthe output image to include a border for bleed; filling all transparentareas of the output image with the one or more substrate attributevalues; creating and storing a cutting path; creating and storing a maskimage; digitally inverting the mask image in the memory; modifying themask image to adjust one or more fill areas around one or more details,to limit negative areas to be less than the maximum number of negativeareas, and to limit positive areas to be less than the maximum number ofpositive areas, resulting in a modified mask image; creating and storingcutting path data in the memory, comprising a vector path on an outlineof the mask image; transmitting the cutting path data over a computernetwork.
 2. The method of claim 1, wherein the output image includesalpha channel data, and wherein creating and storing a mask imagecomprises copying the alpha channel data to a one-channel image having asame size as the output image
 3. The method of claim 1 furthercomprising preprocessing the plurality of design elements of the inputdigital image by one or more of: creating alpha channel data for theinput digital image when the input digital image lacks alpha channeldata; for each of one or more text elements in the input digital image,creating a background balloon having a color, texture or pattern thatcorresponds to the substrate.
 4. The method of claim 1, furthercomprising: copying the mask image in memory to create a one-channelfill image of a same size as the mask image; based on a fill size valueand a pixels-per-inch value, shrinking a fill image size of the fillimage by a product of the fill size value and pixels-per-inch value, andgrowing the fill image size of the fill image by a product of the fillsize value and pixels-per-inch value; setting each pixel in the maskimage to a lesser value of a mask image pixel value and a fill imagepixel value, resulting in modified mask image data for an opaque regionthat covers all the design including fine details.
 5. The method ofclaim 1 wherein the one or more substrate attribute values comprise anyone or more of color, texture and pattern of the substrate.
 6. Themethod of claim 1, further comprising: using the cutting path data,driving a cutting machine to cut a thermal transfer film; removingselected image area from the thermal transfer film; heat transferringthe thermal transfer film to the substrate.
 7. The method of claim 1,further comprising: using the cutting path data, driving a cuttingmachine to cut a film on a backing sheet to describe a decorative designand to provide a registration means; attaching a film portioncorresponding to unused portions of the design to a receiving sheetusing the registration means and an attachment means; removing the filmportion corresponding to the unused portions of the design from thebacking sheet using the receiving sheet; attaching a second film portioncorresponding to remaining portions of the design on the backing sheetto the substrate.
 8. The method of claim 7, wherein the cutting meansand the attachment means are automated by a positioning means and amotion control means.
 9. The method of claim 8, wherein the motioncontrol means and the positioning means are controlled by a series ofinstructions.
 10. The method of claim 9, wherein a second series ofinstructions for motion control of the attachment means is derived fromthe cutting path data.
 11. The method of claim 1, further comprising:using the cutting path data, driving a cutting means to cut a thermaladhesive film on a backing sheet to describe a decorative design and toprovide a registration means; attaching unused portions of the film to areceiving sheet using a registration means and a thermal attachmentmeans; removing the unused portions of the film from the backing sheetusing the receiving sheet; attaching remaining portions of the film tothe substrate.
 12. The method of claim 11, wherein the cutting means andthe attachment means are automated by a positioning means and a motioncontrol means.
 13. The method of claim 12, wherein the motion controlmeans and the positioning means are controlled by a series ofinstructions.
 14. The method of claim 13, wherein a second series ofinstructions for motion control of the attachment means is derived fromthe cutting path data.
 15. The method of claim 1 wherein the substratecomprises an article of wearing apparel.